NSN 5961-00-276-8265 · NIIN 002768265 · FSC 5961
NO DASHES 5961002768265
In Stock
SEMICONDUCTOR DEVICE,DIODE
Semiconductor Devices and Associated Hardware
Technical characteristics
14 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| CTRD | POWER RATING PER CHARACTERISTIC | WATTS MAXIMUM TOTAL POWER DISSIPATION 1.0 |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CELSIUS AMBIENT AIR 200.0 |
| MATT | MATERIAL | ENCLOSURE GLASS |
| MATT | MATERIAL | SEMICONDUCTOR SILICON |
| TTQY | TERMINAL TYPE AND QUANTITY | UNINSULATED WIRE LEAD 2 |
| ZZZK | SPECIFICATION/STANDARD DATA | PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION 80131-RELEASE5137 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | MAXIMUM NOMINAL REGULATOR VOLTAGE 6.2 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT 41.00 |
| ABHP | OVERALL LENGTH | INCHES MAXIMUM 0.300 |
| ABJT | TERMINAL LENGTH | INCHES MINIMUM 1.000 |
| ADAV | OVERALL DIAMETER | INCHES MAXIMUM 0.140 |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | D0-15 |
| AXGY | MOUNTING METHOD | TERMINAL |