NSN 3670-01-147-1768 · NIIN 011471768 · FSC 3670
NO DASHES 3670011471768
In Stock
DICING SAW,MICROELECTRONIC DEVIC
Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery
Technical characteristics
1 row
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| TEXT | GENERAL CHARACTERISTICS ITEM DESCRIPTION | WAFER SIZE UP TO 4.0IN. MAX.; SPINDLE SPEED 30000RPM AT 60HZ; ELECTRICAL-115VAC,60HZ,500VA; DIMENSIONS-LENGTH 25.250IN.,WIDTH 20.750IN.,HEIGHT 11IN.,WEIGHT 110LBS; CHUCK CARRIAGE 5.250IN. MAX.; SPINDLE CARRIAGE 4.250IN. MAX.; 28 SPEED INCREMENTS; OPTICS-MONOCULAR ERECT IMAGE WITH VIEWSCREEN 2IN. BY 2IN.,60X MAGNIFICATION |
Cross-references
1 manufacturer part number on file for this NSN — each shown against the CAGE code it belongs to.
| Manufacturer part number | CAGE |
|---|---|
| 602 | 59722 |