NSN 5961-01-069-7726 · NIIN 010697726 · FSC 5961
NO DASHES 5961010697726
In Stock
SEMICONDUCTOR DEVICE,DIODE
Semiconductor Devices and Associated Hardware
Technical characteristics
14 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| ABHP | OVERALL LENGTH | INCHES MINIMUM 0.230 AND INCHES MAXIMUM 0.275 |
| ABJT | TERMINAL LENGTH | INCHES MINIMUM 1.000 |
| ADAV | OVERALL DIAMETER | INCHES MAXIMUM 0.105 |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | D07-1 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | MAXIMUM WORKING PEAK REVERSE VOLTAGE, MAXIMUM PEAK TOTAL VALUE 15.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | MILLIAMPERES MAXIMUM FORWARD CURRENT, DC 150.00 |
| CTRD | POWER RATING PER CHARACTERISTIC | MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION 250.0 |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CELSIUS JUNCTION 175.0 |
| FEAT | SPECIAL FEATURES | 21 NOV 00; GIRDER PROJECT, ZG NON-CONCUR TO CANCELLATION ACTION; JUNCTION PATTERN ARRANGEMENT: PN |
| MATT | MATERIAL | ENCLOSURE GLASS |
| MATT | MATERIAL | SEMICONDUCTOR SILICON |
| TTQY | TERMINAL TYPE AND QUANTITY | UNINSULATED WIRE LEAD 2 |