NSN 5961-01-470-6985 · NIIN 014706985 · FSC 5961
NO DASHES 5961014706985
In Stock
SEMICONDUCTOR DEVICES,UNITIZED
Semiconductor Devices and Associated Hardware
Application: E/I FSCM AIRCRAFT,B-2 BOMBER (ATB)
Technical characteristics
16 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| ABHP | OVERALL LENGTH | INCHES MAXIMUM 0.770 |
| ABKW | OVERALL HEIGHT | INCHES MAXIMUM 0.175 |
| ABMK | OVERALL WIDTH | INCHES MAXIMUM 0.310 |
| AGAV | END ITEM IDENTIFICATION | E/I FSCM AIRCRAFT,B-2 BOMBER (ATB) |
| ASKA | COMPONENT NAME AND QUANTITY | TRANSISTOR 4 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | ALL TRANSISTOR SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | ALL TRANSISTOR MAXIMUM DRAIN TO SOURCE VOLTAGE 100.0 AND MAXIMUM DRAIN TO GATE VOLTAGE 100.0 AND MAXIMUM GATE TO SOURCE VOLTAGE 20.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | ALL TRANSISTOR AMPERES MAXIMUM DRAIN CURRENT 0.95 |
| CTRD | POWER RATING PER CHARACTERISTIC | ALL TRANSISTOR WATTS MAXIMUM TOTAL DEVICE DISSIPATION 1.4 |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CELSIUS JUNCTION 150.0 |
| FEAT | SPECIAL FEATURES | HARDNESS CRITICAL PROCESS |
| MATT | MATERIAL | ENCLOSURE CERAMIC |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TEST | TEST DATA DOCUMENT | DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) 07690-632049 |
| TTQY | TERMINAL TYPE AND QUANTITY | PIN 14 |