NSN 5961-01-350-1244 · NIIN 013501244 · FSC 5961
NO DASHES 5961013501244
In Stock
SEMICONDUCTOR DEVICE,DIODE
Semiconductor Devices and Associated Hardware
Technical characteristics
16 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| ABHP | OVERALL LENGTH | INCHES NOMINAL 0.013 |
| ABKW | OVERALL HEIGHT | INCHES MINIMUM 0.005 AND INCHES MAXIMUM 0.008 |
| ABMK | OVERALL WIDTH | INCHES NOMINAL 0.013 |
| AFZC | FUNCTION FOR WHICH DESIGNED | SWITCHING |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CBBL | FEATURES PROVIDED | MOUNTING PAD |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | MINIMUM BREAKDOWN VOLTAGE, DC 100.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | MICROAMPERES MAXIMUM REVERSE CURRENT, DC 10.00 |
| CTRD | POWER RATING PER CHARACTERISTIC | MILLIWATTS MAXIMUM COLLECTOR POWER DISSIPATION 200.0 |
| CTRG | CAPACITANCE RATING IN PICOFARADS | MAXIMUM 0.1 |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CELSIUS AMBIENT AIR 85.0 |
| FEAT | SPECIAL FEATURES | THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO GOLD PLATED ALUMINUM USING A SILVER FILLED CONDUCTIVE EPOXY; JUNCTION PATTERN ARRANGEMENT: PN |
| MATT | MATERIAL | SEMICONDUCTOR SILICON |
| PMLC | PRECIOUS MATERIAL AND LOCATION | GOLD TER-INAL SURFACES |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | BONDING PAD 1 |