NSN 5961-01-062-5743 · NIIN 010625743 · FSC 5961
NO DASHES 5961010625743
In Stock
TRANSISTOR
Semiconductor Devices and Associated Hardware
Technical characteristics
17 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| ABHP | OVERALL LENGTH | INCHES NOMINAL 0.640 |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| AXGY | MOUNTING METHOD | THREADED STUD(S) |
| CQJX | NOMINAL THREAD SIZE | INCHES 0.164 |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN 55.0 AND MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN 33.0 AND MAXIMUM BREAKDOWN VOLTAGE, EMITTER-TO-BASE, COLLECTOR OPEN 3.5 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC 250.00 |
| CTRD | POWER RATING PER CHARACTERISTIC | WATTS MAXIMUM TOTAL POWER DISSIPATION 5.0 |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CELSIUS JUNCTION 200.0 |
| FEAT | SPECIAL FEATURES | CERAMIC CASE CONTAINS BERYLLIUM OXIDE - HANDLE AND DISPOSE IAW HAZMAT PROCEDURES; JUNCTION PATTERN ARRANGEMENT: NPN |
| MATT | MATERIAL | ENCLOSURE CERAMIC |
| PMLC | PRECIOUS MATERIAL AND LOCATION | GOLD CHI -ETALLIZATION AND INTERNAL @WIRES |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) 13499-352-1059 |
| THSD | THREAD SERIES DESIGNATOR | UNIFIED NATIONAL COARSE (UNC) |
| TTQY | TERMINAL TYPE AND QUANTITY | RIBBON 4 |