NSN 5961-01-527-7593 · NIIN 015277593 · FSC 5961
NO DASHES 5961015277593
In Stock
TRANSISTOR
Semiconductor Devices and Associated Hardware
Application: NEXT ASSEMBLY 6130-01-446-2018MZ
Technical characteristics
12 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| AXGY | MOUNTING METHOD | TERMINAL AND UNTHREADED HOLE(S) |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-204AA(MODIFIED TO-3) |
| TTQY | TERMINAL TYPE AND QUANTITY | PIN 2 AND UNTHREADED HOLE 2 |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | MAXIMUM BREAKDOWN VOLTAGE, GATE-TO-SOURCE, WITH ALL OTHER TERMINALS SHORT-CIRCUITED TO SOURCE 150.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | AMPERES MAXIMUM DRAIN CURRENT 10.00 |
| CTRD | POWER RATING PER CHARACTERISTIC | WATTS MAXIMUM TOTAL POWER DISSIPATION 150.0 |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | TRANSISTOR,N-CHANNEL HEX-FET POWER |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| ABHP | OVERALL LENGTH | INCHES MINIMUM 1.181 AND INCHES MAXIMUM 1.544 |
| AGAV | END ITEM IDENTIFICATION | NEXT ASSEMBLY 6130-01-446-2018MZ |
| AKPV | MOUNTING FACILITY QUANTITY | 2 |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |