NSN 3670-01-255-3269 · NIIN 012553269 · FSC 3670
NO DASHES 3670012553269
In Stock
LAMINATING MACHINE,PRINTED CIRCU
Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery
Technical characteristics
2 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | BONDER AUTOCLAVE SYSTEM |
| TEXT | GENERAL CHARACTERISTICS ITEM DESCRIPTION | OPERATES UNDER CONTROL TEMPERATURES OF UP TO 700 DEG F AND PRESSURES UP TO 300 PSIG FOR COMPOSITE BONDING,GLASS LAMINATING AND RUBBER CURING; VESSEL WORKSPACE 13.000 IN. SQ BY 36.000 IN. L; 2 DOOR ASSEMBLIES; HORIZONTAL LOADING; VESSEL SHELL I.D. 22.600 IN.; NITROGEN OR AIR PRESSURIZING MEDIUM |