NSN 5961-01-199-2832 · NIIN 011992832 · FSC 5961
NO DASHES 5961011992832
In Stock
SEMICONDUCTOR DEVICE,DIODE
Semiconductor Devices and Associated Hardware
Technical characteristics
13 rows
Straight from the federal item record. Entries the record leaves empty are shown empty — nothing is filled in on its behalf.
| MRC | Requirement | Value |
|---|---|---|
| ABHP | OVERALL LENGTH | INCHES NOMINAL 0.200 |
| ABJT | TERMINAL LENGTH | INCHES NOMINAL 1.500 |
| ADAV | OVERALL DIAMETER | INCHES NOMINAL 0.090 |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-35 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | MAXIMUM BREAKDOWN VOLTAGE, DC 13.0 |
| CTQS | VOLTAGE TOLERANCE IN PERCENT | -5.0 TO 5.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | MICROAMPERES MAXIMUM REVERSE CURRENT, DC 5.00 |
| CTRD | POWER RATING PER CHARACTERISTIC | MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION 400.0 |
| MATT | MATERIAL | SEMICONDUCTOR SILICON |
| MATT | MATERIAL | ENCLOSURE GLASS |
| TTQY | TERMINAL TYPE AND QUANTITY | UNINSULATED WIRE LEAD 2 |